Publicaciones en colaboración con investigadores/as de University of Stuttgart (10)

2008

  1. Focused ion beam preparation of atom probe specimens containing a single crystallographically well-defined grain boundary

    Micron, Vol. 39, Núm. 1, pp. 45-52

2005

  1. Microstructural development of Sn-Ag-Cu solder joints

    Journal of Electronic Materials, Vol. 34, Núm. 2, pp. 137-142

2004

  1. Analytical electron microscopy in a discontinuous precipitated Cu-In alloy

    Microchimica Acta

  2. Diffusion processes in diffusion-soldered interconnections

    Archives of Metallurgy and Materials, Vol. 49, Núm. 2, pp. 277-291

  3. Fundamentals of diffusion along moving grain boundaries

    Archives of Metallurgy and Materials, Vol. 49, Núm. 2, pp. 293-304

  4. The solubility of C in solid Cu

    Scripta Materialia, Vol. 51, Núm. 1, pp. 1-5

2003

  1. Discontinuous precipitation in a Cu-4.5 at.-%ln alloy

    Materials Science and Technology, Vol. 19, Núm. 11, pp. 1539-1545

  2. Grain boundary and surface segregation in the Cu-Bi system

    Scripta Materialia, Vol. 49, Núm. 8, pp. 747-753

  3. Kinetic behaviour of diffusion-soldered Ni/Al/Ni interconnections

    Materials Chemistry and Physics, Vol. 78, Núm. 2, pp. 459-463

2002

  1. Phase characterization of diffusion soldered Ni/Al/Ni interconnections

    Interface Science, Vol. 10, Núm. 1, pp. 13-19