High density, low leakage back-end 3D capacitors for mixed signals applications

  1. Detalle, M.
  2. Barrenetxea, M.
  3. Muller, P.
  4. Potoms, G.
  5. Phommahaxay, A.
  6. Soussan, P.
  7. Vaesen, K.
  8. De Raedt, W.
Revue:
Microelectronic Engineering

ISSN: 0167-9317

Année de publication: 2010

Volumen: 87

Número: 12

Pages: 2571-2576

Type: Article

DOI: 10.1016/J.MEE.2010.07.020 GOOGLE SCHOLAR
La source de données: Scopus