3D structuring of polymer parts using thermoforming processes

  1. Senn, T.
  2. Waberski, C.
  3. Wolf, J.
  4. Esquivel, J.P.
  5. Sabaté, N.
  6. Löchel, B.
Journal:
Microelectronic Engineering

ISSN: 0167-9317

Year of publication: 2011

Volume: 88

Issue: 1

Pages: 11-16

Type: Article

DOI: 10.1016/J.MEE.2010.08.003 GOOGLE SCHOLAR
Data source: Scopus