A methodology to determine reliability issues in automotive SiC power modules combining 1D and 3D thermal simulations under driving cycle profiles

  1. Matallana, A.
  2. Robles, E.
  3. Ibarra, E.
  4. Andreu, J.
  5. Delmonte, N.
  6. Cova, P.
Revista:
Microelectronics Reliability

ISSN: 0026-2714

Ano de publicación: 2019

Volume: 102

Tipo: Artigo

DOI: 10.1016/J.MICROREL.2019.113500 GOOGLE SCHOLAR
Fonte de datos: Scopus