A methodology to determine reliability issues in automotive SiC power modules combining 1D and 3D thermal simulations under driving cycle profiles
- Matallana, A.
- Robles, E.
- Ibarra, E.
- Andreu, J.
- Delmonte, N.
- Cova, P.
Aldizkaria:
Microelectronics Reliability
ISSN: 0026-2714
Argitalpen urtea: 2019
Alea: 102
Mota: Artikulua