A methodology to determine reliability issues in automotive SiC power modules combining 1D and 3D thermal simulations under driving cycle profiles

  1. Matallana, A.
  2. Robles, E.
  3. Ibarra, E.
  4. Andreu, J.
  5. Delmonte, N.
  6. Cova, P.
Revista:
Microelectronics Reliability

ISSN: 0026-2714

Any de publicació: 2019

Volum: 102

Tipus: Article

DOI: 10.1016/J.MICROREL.2019.113500 GOOGLE SCHOLAR
Font de les dades: Scopus