Multifunctional photocurable advanced materials for electronics and sensing applications

  1. MENDES FELIPE, JESUS CRISTIAN
Dirigida por:
  1. Senén Lanceros Méndez Director
  2. José Luis Vilas Vilela Director

Universidad de defensa: Universidad del País Vasco - Euskal Herriko Unibertsitatea

Fecha de defensa: 18 de diciembre de 2020

Tribunal:
  1. Clarisse Marta de Oliveira Ribeiro Presidente/a
  2. Leyre Pérez Álvarez Secretaria
  3. Jose Maria Cuevas Zarraga Vocal

Tipo: Tesis

Teseo: 153489 DIALNET lock_openADDI editor

Resumen

Photocurable multifunctional polymer composites have been obtained and characterized according totheir photopolymerization capability, physico-chemical and functional properties. Polyurethane acrylate(PUA) has been selected as polymer matrix combined with multi-walled carbon nanotubes (MWCNT),barium titante (BaTiO3), indium tin oxide (ITO), magnetite (Fe3O4), cobalt ferrite (CFO), neodymiumiron boron alloy (NdFeB) and 1-buthyl-3-methylimidazolium tetracholonickelate ([Bmim]2NiCl4) ionicliquid (IL) to obtain different functional and multifunctional responses.Different functional and multifunctional responses have been added to the UV curable polymer,depending on the filler type and content. The inclusion of MWCNTs induce a piezoresistive responsecharacterized by GF values between 0.8 and 2.6. BaTiO3 and ITO, strongly increase the dielectricconstant from 7.5 to 25 and up to 33, respectively. In the case of Fe3O4, CFO and NdFeB, magneticcomposites with tailored magnetic properties (from hard to soft magnetic ones) are obtained. Saturationmagnetization values up to 63.86 emu/g, remanence up to 44.95 emu/g and coercivity up to 7000 Oe havebeen obtained depending on filler type and content. Finally, IL allows the preparation of temperatureactivated thermochromic humidity sensing materials with a colour change from blue to colourless,depending on relative humidity.Thus, this work successfully demonstrated the development of UV photocurable functional andmultifunctional materials, compatible with printing technologies, for electronic and sensing applications.