Transmission electron microscopy of diffusion-soldered Ni/Al/Ni interconnections

  1. Jezierska, E.
  2. López, G.A.
  3. Zieba, P.
Journal:
Materials Chemistry and Physics

ISSN: 0254-0584

Year of publication: 2003

Volume: 81

Issue: 2-3

Pages: 569-572

Type: Conference paper

DOI: 10.1016/S0254-0584(03)00077-4 GOOGLE SCHOLAR
Data source: Scopus