Microstructural development of Sn-Ag-Cu solder joints

  1. Fix, A.R.
  2. López, G.A.
  3. Brauer, I.
  4. Nüchter, W.
  5. Mittemeijer, E.J.
Revue:
Journal of Electronic Materials

ISSN: 0361-5235

Année de publication: 2005

Volumen: 34

Número: 2

Pages: 137-142

Type: Article

DOI: 10.1007/S11664-005-0224-0 GOOGLE SCHOLAR
La source de données: Scopus