Natural convective cooling of electronics contained in tilted hemispherical enclosure filled with a porous medium saturated by water-copper nanofluid

  1. Baïri, A.
  2. Bauzin, J.-G.
  3. Martín-Garín, A.
  4. Alilat, N.
  5. Millán-García, J.A.
Aldizkaria:
International Journal of Numerical Methods for Heat and Fluid Flow

ISSN: 0961-5539

Argitalpen urtea: 2019

Alea: 29

Zenbakia: 1

Orrialdeak: 280-293

Mota: Artikulua

DOI: 10.1108/HFF-01-2018-0036 GOOGLE SCHOLAR

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