Strain relief during metal-on-metal electrodeposition: A scanning tunneling microscopy study of copper growth on Pt(100)

  1. Bittner, A.M.
  2. Wintterlin, J.
  3. Ertl, G.
Revue:
Surface Science

ISSN: 0039-6028

Année de publication: 1997

Volumen: 376

Número: 1-3

Pages: 267-278

Type: Article

DOI: 10.1016/S0039-6028(96)01395-7 GOOGLE SCHOLAR
La source de données: Scopus