Vacuum packaging and semipassive chips for wireless temperature monitoring in industrial applications

  1. Tijero, M.
  2. Eguiluz, X.
  3. Elizalde, J.
  4. Diez, V.
  5. Arriola, A.
  6. Aranburu, I.
  7. Zarketa, A.
  8. Martinez-Agirre, M.
  9. Martin-Mayor, A.
  10. Bou-Ali, M.M.
Actas:
Proceedings of IEEE Sensors

ISSN: 2168-9229,  1930-0395

ISBN: 9781509010127

Ano de publicación: 2017

Volume: 2017-December

Páxinas: 1-3

Tipo: Achega congreso

DOI: 10.1109/ICSENS.2017.8234235 GOOGLE SCHOLAR lock_openeBiltegia editor
Fonte de datos: Scopus